MOUNTING OF ELECTRONIC COMPONENT BY EUTECTIC DIE BONDER

PURPOSE:To simply correct a displacement of an electronic component by a method wherein a thermally expanded amount of a substrate is observed by using a camera and a movable table is shifted so as to correct landing coordinates of the electronic component on the basis of this observed result. CONSTITUTION:A substrate 2 is heated preliminarily in a preliminary heating apparatus 3; then, it is heated to a eutectic temperature or higher in a main heating apparatus 4. On the other hand, a transfer head 10 is shifted back and forth between a die ejector 7 and an alignment part by it picks up an electronic component on a wafer 9 pushed up by using a pin of the die ejector 7, and transfers it to the alignment part 8; a displacement is observed and corrected. Then, a mounting head 11 sucks and picks up the electronic component in the alignment part 8; it makes its way into the inside from an opening part 23 formed in a cover body 18; it transfers and loads the component on the substrate 22 which has been heated in the main heating apparatus 4. Then, while a thermally expanded amount of the substrate 2 is being observed by using a camera 24 installed at the upper part of the cover body 18, movable tables 21, 22 are shifted slightly and rubbed, and electronic components P are bonded to the substrate 2.