WIRING BOARD CAPABLE OF PACKAGING ELECTRIC COMPONENT WITHOUT SOLDER

PURPOSE:To package an electric component on a wiring substrate without solder by a method wherein an electric circuit pattern is formed of a metal material, a punched part is provided to the metal material, and a spring member is provided to the punched part to pinch the legs of the electric compone...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOI JUNICHI, SAITO SATOSHI, ICHIGE TOSHIAKI, MATSUO HIDEO, SAITO RIKIO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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