WIRING BOARD CAPABLE OF PACKAGING ELECTRIC COMPONENT WITHOUT SOLDER

PURPOSE:To package an electric component on a wiring substrate without solder by a method wherein an electric circuit pattern is formed of a metal material, a punched part is provided to the metal material, and a spring member is provided to the punched part to pinch the legs of the electric component. CONSTITUTION:A metal plate 2, which forms an electric pattern, is arranged taking advantage of a support member 5 formed on an insulating substrate 1, a spring member 7 is provided to the punched part 3, which is formed by bending a punched tongue 4 of the metal plate 2 downward, proximately to the tongue 4. The legs of the electric component are pinched between the tongue 4 and the spring member 7, and the legs of the electric component are held by the force due to the spring action of the spring member 7, so that the package of an electric component without solder can be realized. Here, the spring member 7 can be fixed to the insulating substrate by fitting a hole 8 provided to one end of the spring member 7 to the protrusion which is provided onto the support member 5.