CUT-SHAPING DIE

PURPOSE:To obtain a cut-shaping die capable of performing a cut-shaping processing of the lead of a semiconductor device with high accuracy by a method wherein a lead cut bending punch and a lead bending die, which bend and shape the lead, are formed into such a configuration as to come into contact...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KARUBE TETSUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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