CUT-SHAPING DIE

PURPOSE:To obtain a cut-shaping die capable of performing a cut-shaping processing of the lead of a semiconductor device with high accuracy by a method wherein a lead cut bending punch and a lead bending die, which bend and shape the lead, are formed into such a configuration as to come into contact with the lead in the immediate neighborhood of a bending part and as not to come into contact with the point of the lead. CONSTITUTION:Parts, which come into contact to the point part of a lead 3b of a semiconductor device 3, of a lead cut bending punch 1 and a lead bending die 2 are respectively provided with a relief 1a and a relief 2a, the lead 3b is subjected to bending work at its part only in the immediate neighborhood of a second bending part 2c and the point part of the lead 3b is kept in a free state. When a bending work of the lead 3b of the device 3 is performed by this die, leads are subjected to bending work on a condition different from one another in every lead and compared with leads in which a loosening has been generated, a loosening of the leads is improved from the largest loosening of 0.14mm to a loosening of 0.10mm.