MANUFACTURE OF BONDING TOOL
PURPOSE:To prevent the generation of a crack in a carbide member and to maintain highly the bonding strength of the carbide member to a shrank by a method wherein one obtainable by adding powdered shrinkage stress relaxation materials to a silver solder is used as a silver solder and the carbide mem...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To prevent the generation of a crack in a carbide member and to maintain highly the bonding strength of the carbide member to a shrank by a method wherein one obtainable by adding powdered shrinkage stress relaxation materials to a silver solder is used as a silver solder and the carbide member is soldered to the shank. CONSTITUTION:A carbide member 1 is soldered to a low-thermal expansibility shrank 4 using tungsten or molybdenum or the like as its material with a silver solder 2 containing powdered shrinkage stress relaxation materials 3. As the member 1, one consisting of such a material as a single crystal diamond and a diamond sintered body is exemplified. As the silver solder, one obtainable by adding titanium to a composition of JIS BAg-8 and the like are exemplified and the powdered shrinkage stress relaxation materials are contained in the silver solder. These relaxation materials act as a buffer material to the solidification shrinkage force of the silver solder and the thermal expansion shrinkage force of the shrank, prevent a stress from concentrating on the carbide member to inhibit a soldering distortion and prevent the generation of a crack. As the relaxation materials, diamond powder, quartz glass powder and so on are exemplified. |
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