RESIN SEALING DIE
PURPOSE:To prevent resin burrs from being formed between the leads of a lead frame at the time of resin sealing by a method wherein the title metal mold is constituted in such a way that when a top force or a bottom force having resin stoppers is fitted into the bottom force or the top force to corr...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE:To prevent resin burrs from being formed between the leads of a lead frame at the time of resin sealing by a method wherein the title metal mold is constituted in such a way that when a top force or a bottom force having resin stoppers is fitted into the bottom force or the top force to correspond to the above top force or bottom force, the gap between the surface of the lead frame and the top and bottom forces is eliminated. CONSTITUTION:Resin stoppers 6 formed on a bottom force 3 are fitted into recessed parts 11 formed in a top force 2 and leads 5 of a lead frame 4 are provided between the top and bottom forces 2 and 3. The projecting amount of each stopper 6 is larger than the plate thickness of the lead frame 4, but the stoppers 6 are fitted into the recessed parts 11 of the force 2 and the leads 5 are pinched between the forces 2 and 3 in such a way that no gap is generated between the surface of the lead frame 4 and the forces 2 and 3. In such a way, as the stoppers 6, each consisting of each recessed part projecting larger than the plate thickness of the lead frame, are respectively made to position between the leads of the lead frame 4, a resin does not flow in between the leads at the time of resin sealing and resin burrs are prevented from being formed between the leads. Moreover, as the leads are pinched between the forces 2 and 3 in such a way that no gap is generated between the surface of the lead frame and the forces 2 and 3, resin flashes are prevented from being formed at the time of resin sealing. |
---|