PARTS MOUNTING STRUCTURE

PURPOSE:To prevent occurrence of blow holes in a fillet section so as to obtain a well-soldered part by mounting parts on a base plate in a state where the parts are raised from the surface of the base plate by means of wire rods. CONSTITUTION:All wire rods 5, 5', and 5'' are provided...

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Bibliographische Detailangaben
1. Verfasser: TANEDA KOKI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To prevent occurrence of blow holes in a fillet section so as to obtain a well-soldered part by mounting parts on a base plate in a state where the parts are raised from the surface of the base plate by means of wire rods. CONSTITUTION:All wire rods 5, 5', and 5'' are provided to a base plate 2 toward the outside from the inside of its parts mounting surface and, when parts 1 are mounted on the base plate 2, the wire rods are brought into contact with the peripheral section of the fitting surface of the parts 1 and the parts 1 are raised from the surface of the base plate 2, leaving a space through which the recessed section 6 on the fitting surface of the parts 1 can communicate with the outside between the parts 1 and base plate 2. Since lead sections 4 and 4' are soldered to the wiring pattern section of the base plate 2 in such a state, the air in the recessed section 6 between the parts 1 and base plate 2 is heated and expands when the base plate is dipped in a solder bath. However, the air freely escapes to the outside through the space formed between the peripheral section of the fitting surface of the parts 1 and surface of the base plate by means of the wire rods 5, 5', and 5''. Therefore, occurrence of blow holes in the soldered fillet section can be prevented.