COPPER ALLOY FOR TERMINAL AND CONNECTOR HAVING EXCELLENT STRENGTH AND CONDUCTIVITY

PURPOSE:To permit the correspondence of the title alloy to the miniaturization of a terminal and a connector by incorporating specific weight % of Ni, Si, Zn and Mg and one or more kinds among Cr, Ti and Zr into Cu. CONSTITUTION:Ni, 0.4 to 4.0%, by weight, 0.1 to 1.0% Si, 0.05 to 1.0% Zn and 0.05 to...

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Bibliographische Detailangaben
Hauptverfasser: MIYATO MOTOHISA, OGURA TETSUZO, WATARI MASATO, HOSOKAWA ISAO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To permit the correspondence of the title alloy to the miniaturization of a terminal and a connector by incorporating specific weight % of Ni, Si, Zn and Mg and one or more kinds among Cr, Ti and Zr into Cu. CONSTITUTION:Ni, 0.4 to 4.0%, by weight, 0.1 to 1.0% Si, 0.05 to 1.0% Zn and 0.05 to 0.5% Mg are incorporated into Cu. One or more kinds of elements among Cr, Ti and Zr, each 0.001 to =50% IACS conductivity and excellent stress relaxation rate suitable for a connector. By this method, the alloy can corresponds to the miniaturization of a terminal and a connector.