FORMATION OF LEAD PATTERN

PURPOSE:To obtain fine patterns surely and insure performance of a wire bonding by patterning an Al layer which is deposited on a substrate after selectively etching its layer and plating the exposed pattern with Cu after coating bonding pad parts with a plating resist, thereby making the pad parts only from the Al layer. CONSTITUTION:An Al layer is deposited on a substrate 21 consisting of Fe and others through an insulating film 22 such as polymeric resin and the like and then, etching is performed selectively to form the Al layer into desirous patterns 12. Then, lead patterns to be obtained finally, for example, the teeth of comblike leads l which are arranged in parallel, die bonding part D and B, and a mutual coupling part F are allowed to remain and other parts are removed after etching them. The lead patterns 15 are obtained by coating the upper parts of the bonding parts D and B of wire bonding parts W and B with a photoresist and by plating the coupling part F with Cu after using the coupling F as a terminal and, further, by plating the parts other than D and B with Cu. After that, an IC chip is soldered to Al pad parts which are exposed by removing the resist and the terminal is connected to the patterns 15.