PRODUCTION OF HEAT-RESISTANT RESIN COMPOSITION

PURPOSE:To obtain the subject composition of a one-pack type having an excellent shelf life, a low viscosity and a long pot life by reacting a bismaleimide compound with a normally liquid epoxy resin by heating and adding a plurality of specified compounds to the reaction mixture. CONSTITUTION:A bis...

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Bibliographische Detailangaben
1. Verfasser:	KADOI HARUO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the subject composition of a one-pack type having an excellent shelf life, a low viscosity and a long pot life by reacting a bismaleimide compound with a normally liquid epoxy resin by heating and adding a plurality of specified compounds to the reaction mixture. CONSTITUTION:A bismaleimide compound (e.g. N,N'-4,4,- diphenylmethanebismaleimide) is reacted with a normally liquid epoxy resin (e.g. bisphenol F epoxy resin) by heating at 130 to 190 deg.C and the product is cooled to 100 deg.C. A normally liquid acid anhydride (e.g. monomethyltetrahydrophthalic anhydride, is added to the cooled mixture, and the resulting mixture is further mixed with a peroxide (e.g. dicumyl peroxide) and/or a latent cure accelerator (e.g. HX-3742, a product of Asahi Kasei; at 70 deg.C or below.