MOUNTING OF ELECTRONIC COMPONENT

PURPOSE:To prevent a bridge detect and to obtain a bonded part full of reliability by a method wherein, when a solder is melted, an electronic component facing a board is lifted up once from the board and the molten solder is spread. CONSTITUTION:When a solder paste is melted, an electronic componen...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NAKAOKA YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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