MOUNTING OF ELECTRONIC COMPONENT

PURPOSE:To prevent a bridge detect and to obtain a bonded part full of reliability by a method wherein, when a solder is melted, an electronic component facing a board is lifted up once from the board and the molten solder is spread. CONSTITUTION:When a solder paste is melted, an electronic component 4 is lifted up from a board 1 by using a suction jig and a solder is spread. That is to say, a volume into which the molten solder can be filled is increased. The electronic component 4 is mounted on the board 1 on which the solder paste has been printed; after that, this assembly is put into an infrared furnace; the solder paste is heated and melted; a soldering operation is executed. During this process, the molten solder is filled between a lead terminal 5 and a pad part 2. Then, the component is lifted up within a range that the solder which is solderable to and comes into contact with the lead terminal 5 is not separated; a volume which can be filled is increased. Thereby, even when the excess solder which has caused a short circuit can be absorbed onto the pad part.