THERMOSETTING PUTTY COMPOSITION

PURPOSE:To provide the subject putty composition having good workability due to the one pack type putty composition and giving cured products having sufficient hardness when heated, by comprising an epoxy resin, a thermoplastic resin, a specific dehydrazide and a filler. CONSTITUTION:The objective c...

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Bibliographische Detailangaben
Hauptverfasser:	KOIKE SHUNKICHI, TANAKA NORIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the subject putty composition having good workability due to the one pack type putty composition and giving cured products having sufficient hardness when heated, by comprising an epoxy resin, a thermoplastic resin, a specific dehydrazide and a filler. CONSTITUTION:The objective composition comprises (A) an epoxy resin (preferably a polyhydric phenol glycidylether), (B) a thermoplastic resin (preferably phenoxy resin, polyurethane resin or rubber-modified epoxy resin), (C) a dihydrazide of the formula (R1 and R2 are H or alkyl) [preferably 1,3-bis(hydrazinocarboethyl)-5-isopropyl hydantoin] as a curing agent and (D) a filler (preferably glass microballon).