MOLD FOR CUTTING AND SHAPING SEMICONDUCTOR

PURPOSE:To prevent adhesion of residual solder and to stabilize pressure exerted to leads during shaping of the leads for preventing deviation or deformation of the leads for realizing highly precise lead shaping by providing a groove in each part where a lead comes into contact on the surface of a bending punch or of a bending die. CONSTITUTION:A resin sealed part of a semiconductor package 14 is inserted in a guide hole 12b to be engaged thereby and leads 13 of the lead frame of the semiconductor package 14 are arranged on the top face of a cutting and bending mold 13 across the top face of a guide section 12a. Then, a punch 11 for cutting and bending the leads is pressed down so that the leads 13 are cut into a predetermined length while they are shaped into predetermined configurations by the lead cutting/bending punch 11 and the bending die section 12c. Since grooves 12d are formed at the center of the regions on the surface of the bending die section 12c where the leads 13 come into contact, no residual solder is deposited there and, therefore, the leads 12 are always subjected to stable pressure during the shaping process. Accordingly, the dimensional precision can be improved since the leads 13 can be prevented from being deviated and hence from being deformed.