EPOXY RESIN COMPOSITION PREVENTED FROM GENERATING CURING STRAIN AND METHOD OF BONDING THEREWITH

PURPOSE:To obtain a resin composition prevented from generating curing strain and causing neither cracking nor peeling by mixing a normally liquid epoxy resin with a latent curing agent and a cure accelerator and further mixing the mixture with a high-melting nylon powder. CONSTITUTION:A normally li...

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Bibliographische Detailangaben
Hauptverfasser: MATSUZAKI KUNIMITSU, AKUTAGAWA ICHIRO, YAMAGUCHI TSUTOMU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To obtain a resin composition prevented from generating curing strain and causing neither cracking nor peeling by mixing a normally liquid epoxy resin with a latent curing agent and a cure accelerator and further mixing the mixture with a high-melting nylon powder. CONSTITUTION:A normally liquid epoxy resin (e.g. a combination of a bisphenol A epoxy resin with a flexible epoxy resin) is mixed with a latent curing agent (e.g. dicyandiamide) and a cure accelerator, e.g. 3-(3,4-dichlorophenyl)1,1- dimethylurea), and the resulting mixture is further mixed with a nylon powder of an m.p. >=170 deg.C (e.g. nylon 11 or nylon 12) to prevent curing strain from generating. The mixing ratio is such that the total weight of the above latent curing agent and the cure accelerator is at least 10 pts.wt. per 100 pts.wt. epoxy resin. In this way, an epoxy resin composition prevented from curing strain generation can be obtained. Two objects and are bonded together through this composition, and the product of bonding is cured by heating to a temperature at which the contained nylon powder does not melt.