EPOXY RESIN MOLDING MATERIAL

Epoxy resin moulding compositions for sheathing semiconductor components which are inexpensive to produce and have good processing properties give, without addition of flameproofing agents, flame-resistant moulded materials of high glass transition temperature and low thermal expansion coefficient i...

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Bibliographische Detailangaben
Hauptverfasser:	UORUFUGANGU FUON GENTSUKOU, DEIITAA UIRUHERUMU, UORUFUGANGU ROGURAA, YURUGEN FUUBAA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Epoxy resin moulding compositions for sheathing semiconductor components which are inexpensive to produce and have good processing properties give, without addition of flameproofing agents, flame-resistant moulded materials of high glass transition temperature and low thermal expansion coefficient if they contain the following components: (A) a phosphorus-free aromatic and/or heterocyclic polyepoxy resin, optionally blended with an aliphatic epoxy resin, (B) an epoxide-containing phosphorus compound, (C) an aromatic polyamine as curing agent, and (D) fillers. t