LASER WELDING FIXED STRUCTURE FOR OPTICAL MODULE

PURPOSE:To surely seal up and fix a fiber holder onto a package by forming a solder agent filling use through-hole for temporary fixation in the fiber holder, at the time of coupling the fiber holder to which an optical fiber is fixed and a package containing an optical semiconductor chip. CONSTITUT...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HORIGOME NOBUYOSHI, MORIYA KAORU
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To surely seal up and fix a fiber holder onto a package by forming a solder agent filling use through-hole for temporary fixation in the fiber holder, at the time of coupling the fiber holder to which an optical fiber is fixed and a package containing an optical semiconductor chip. CONSTITUTION:A laser welding fixed structure is formed by bringing the outside periphery of a fiber holder 5 to which an optical fiber 51 is fixed to laser welding to a package 6 containing an optical semiconductor chip 61. In order to fixing temporarily the fiber holder 5 to the package 6, at least one solder agent filling use through-hole 5a opened to the corresponding joint part of the package 6 is provided on a flange part 5' of the fiber holder 5. By this constitution, the fiber holder 5 and the package 6 are aligned, solder is thrown into the through-hole 5a and melted by a laser, etc., and a solder temporarily fixed part H is formed. Subsequently, the joining part of the outside periphery of the flange part 5' of the fiber holder 5 and the package 6 is brought to laser spot welding, and thereafter, the whole periphery is brought to laser welding and a laser weld zone L is formed.