SEMICONDUCTOR DEVICE

PURPOSE: To protect a semiconductor structure against damage by a method wherein a ductile alloy layer is provided onto the lower main surface of a device composed of two semiconductor bodies whose upper main surface and lower main surface are thermally connected together. CONSTITUTION: A semiconductor device is formed through such a manner that semiconductor body 3 is provided and bonded onto a metal base plate 1 with thermally conductive adhesive agent. A ductile metal laver 8 of aluminum, indium or gold is provided onto the lower main surface of a semiconductor body 5, and the semiconductor body 5 is bonded to the upper surface 4 through the intermediary of the semiconductor body 3 through the intermediary of an adhesive layer 7. The layer 7 is formed thin so as not to stop a heat flow from flowing to the semiconductor body 5, and the semiconductor bodies 3 and 5 are sealed up in a resin package 9 as pressed. By this setup, a vertical force applied to the semiconductor bodies 3 and 5 when a load is varied is canceled by the layer 8, so that a device of this constitution can be protected against damage.