IMAGE FORMING METHOD
PURPOSE:To improve the resolution of resist patterns by using a photoresist film formed by successively laminating a non-tacky photosensitive layer and tacky photosensitive layer having prescribed thicknesses on a base film. CONSTITUTION:The photoresist film is formed by successively laminating the...
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| creator | TOMITA MASAO SHIMOMURA MOTOHIDE |
| description | PURPOSE:To improve the resolution of resist patterns by using a photoresist film formed by successively laminating a non-tacky photosensitive layer and tacky photosensitive layer having prescribed thicknesses on a base film. CONSTITUTION:The photoresist film is formed by successively laminating the non-tacky photosensitive layer (B) and the tacky photosensitive layer (C) having 1 to 10mum thickness on the base film (A). The layer C surface of the film is superposed and press-adhered onto a substrate and after the film A is stripped, pattern masks are brought into tight contact with the layer B and are exposed and developed to form the resist patterns. Since the mask can be directly placed on the layer B, the patterns having the high resolution are obtd. The interlayer adhesive strength of the base body A and the layer B is preferably smaller than the interlayer adhesive strength of the layer B and the layer C. Lamination of a protective film on the layer C is also preferable. |
| format | Patent |
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CONSTITUTION:The photoresist film is formed by successively laminating the non-tacky photosensitive layer (B) and the tacky photosensitive layer (C) having 1 to 10mum thickness on the base film (A). The layer C surface of the film is superposed and press-adhered onto a substrate and after the film A is stripped, pattern masks are brought into tight contact with the layer B and are exposed and developed to form the resist patterns. Since the mask can be directly placed on the layer B, the patterns having the high resolution are obtd. The interlayer adhesive strength of the base body A and the layer B is preferably smaller than the interlayer adhesive strength of the layer B and the layer C. Lamination of a protective film on the layer C is also preferable.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900912&DB=EPODOC&CC=JP&NR=H02230149A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900912&DB=EPODOC&CC=JP&NR=H02230149A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOMITA MASAO</creatorcontrib><creatorcontrib>SHIMOMURA MOTOHIDE</creatorcontrib><title>IMAGE FORMING METHOD</title><description>PURPOSE:To improve the resolution of resist patterns by using a photoresist film formed by successively laminating a non-tacky photosensitive layer and tacky photosensitive layer having prescribed thicknesses on a base film. CONSTITUTION:The photoresist film is formed by successively laminating the non-tacky photosensitive layer (B) and the tacky photosensitive layer (C) having 1 to 10mum thickness on the base film (A). The layer C surface of the film is superposed and press-adhered onto a substrate and after the film A is stripped, pattern masks are brought into tight contact with the layer B and are exposed and developed to form the resist patterns. Since the mask can be directly placed on the layer B, the patterns having the high resolution are obtd. The interlayer adhesive strength of the base body A and the layer B is preferably smaller than the interlayer adhesive strength of the layer B and the layer C. Lamination of a protective film on the layer C is also preferable.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDx9HV0d1Vw8w_y9fRzV_B1DfHwd-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GRkbGBoYmlo7GxKgBAG6ZHp0</recordid><startdate>19900912</startdate><enddate>19900912</enddate><creator>TOMITA MASAO</creator><creator>SHIMOMURA MOTOHIDE</creator><scope>EVB</scope></search><sort><creationdate>19900912</creationdate><title>IMAGE FORMING METHOD</title><author>TOMITA MASAO ; SHIMOMURA MOTOHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH02230149A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1990</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TOMITA MASAO</creatorcontrib><creatorcontrib>SHIMOMURA MOTOHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOMITA MASAO</au><au>SHIMOMURA MOTOHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMAGE FORMING METHOD</title><date>1990-09-12</date><risdate>1990</risdate><abstract>PURPOSE:To improve the resolution of resist patterns by using a photoresist film formed by successively laminating a non-tacky photosensitive layer and tacky photosensitive layer having prescribed thicknesses on a base film. CONSTITUTION:The photoresist film is formed by successively laminating the non-tacky photosensitive layer (B) and the tacky photosensitive layer (C) having 1 to 10mum thickness on the base film (A). The layer C surface of the film is superposed and press-adhered onto a substrate and after the film A is stripped, pattern masks are brought into tight contact with the layer B and are exposed and developed to form the resist patterns. Since the mask can be directly placed on the layer B, the patterns having the high resolution are obtd. The interlayer adhesive strength of the base body A and the layer B is preferably smaller than the interlayer adhesive strength of the layer B and the layer C. Lamination of a protective film on the layer C is also preferable.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS |
| title | IMAGE FORMING METHOD |
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