IMAGE FORMING METHOD

PURPOSE:To improve the resolution of resist patterns by using a photoresist film formed by successively laminating a non-tacky photosensitive layer and tacky photosensitive layer having prescribed thicknesses on a base film. CONSTITUTION:The photoresist film is formed by successively laminating the non-tacky photosensitive layer (B) and the tacky photosensitive layer (C) having 1 to 10mum thickness on the base film (A). The layer C surface of the film is superposed and press-adhered onto a substrate and after the film A is stripped, pattern masks are brought into tight contact with the layer B and are exposed and developed to form the resist patterns. Since the mask can be directly placed on the layer B, the patterns having the high resolution are obtd. The interlayer adhesive strength of the base body A and the layer B is preferably smaller than the interlayer adhesive strength of the layer B and the layer C. Lamination of a protective film on the layer C is also preferable.