CONDUCTIVE PASTE AND MANUFACTURE OF CONDUCTOR

PURPOSE:To form a fine and sharp circuit pattern by preparing conductive paste made of a kneaded material containing conductive fine powder having a specific average particle diameter and an organic metallic compound. CONSTITUTION:As essential components, conductive fine powder having an average par...

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Bibliographische Detailangaben
1. Verfasser: HAMAMURA KIYOTO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To form a fine and sharp circuit pattern by preparing conductive paste made of a kneaded material containing conductive fine powder having a specific average particle diameter and an organic metallic compound. CONSTITUTION:As essential components, conductive fine powder having an average particle diameter of 0.1mu or less, and an organic metallic compound or resinated paste are kneaded, thereby preparing conductive paste. Accordingly, a circuit pattern of a high density wiring having a pitch of 100mum or less or the like can be easily formed, and further, a high temperature sintering process in forming the circuit pattern or the like is not required so that thermal effects on other electronic components can be reduced. Namely, due to elimination of resin, a phenomenon such as bleeding is unliable to be generated even in printing the circuit pattern. Therefore, a fine and sharp wiring pattern can be easily formed.