METHOD AND DEVICE FOR SIZING OF SURFACE POLISHING DEVICE

PURPOSE:To remove the effect of the vibration of a surface plate and the like and control the finishing thickness of a workpiece in high accuracy by comparing the average value of thickness data corresponding to one turn of an upper surface plate with a set value, at the time of polishing a workpiece by means of a surface polishing device. CONSTITUTION:In a surface polishing device, a workpiece 6 is held by a carrier 5 which is driven in a form of a planetary gear by means of a sun gear 3 and an internal gear 4, and is polished by means of upper/lower surface plates 1, 2. Hence, the displaced position of the upper surface plate 1 is detected by a position sensor, the displaced quantity is converted into the thickness data of the workpiece 6 for each minute time and, each time the surface plate makes a turn, the average value of the plurality of thickness data corresponding to one turn is operated. The operated average value is compared with a set value and machining is finished when the average value becomes below a set value.