SURFACE TREATMENT DEVICE FOR MAGNETIC DISK SUBSTRATE

PURPOSE:To treat the surface of a magnetic disk substrate with a uniform surface roughness by providing a mechanism which not only pushes a minute cutting blade into the rotating substrate but also moves the cutting blade in the radial direction of the substrate, and a damping mechanism which absorb...

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1. Verfasser: HYONO TADASHI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To treat the surface of a magnetic disk substrate with a uniform surface roughness by providing a mechanism which not only pushes a minute cutting blade into the rotating substrate but also moves the cutting blade in the radial direction of the substrate, and a damping mechanism which absorbs oscillation of the cutting blade. CONSTITUTION:A magnetic disk substrate 1 to be treated, a tool 2 having the minute cutting blade like a diamond cutting tool 2, and an air cylinder 3 to press the tool 2 onto the substrate 1 are provided. The air cylinder 3 has the damping effect to absorb oscillation of the blade due to waving or surface shake of the substrate 1, and a feed mechanism 4 which moves the tool 2 from the inside or outside peripheral side to the outside or inside peripheral side of the substrate 1 is provided. The substrate 1 is rotated with a prescribed rotational frequency and the minute cutting blade 2 is pressed onto the substrate 1 by the air cylinder 3, and at such a time, it is preferable that the speed of the air cylinder 3 is reduced, and the pushing-in force for the cutting blade 2 is adjusted by the air pressure.