METHOD FOR PACKAGING AND PACKAGE

PURPOSE:To simply unpack a package with scores by a method wherein a heat-shrinkable synthetic resin film is used as a top and a bottom while heat- shrinkable packaging is performed with continuous scores for cutting made on the synthetic resin film. CONSTITUTION:Tips of an upper and a lower films 1...

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Bibliographische Detailangaben
1. Verfasser: KIKUCHI SHIZUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To simply unpack a package with scores by a method wherein a heat-shrinkable synthetic resin film is used as a top and a bottom while heat- shrinkable packaging is performed with continuous scores for cutting made on the synthetic resin film. CONSTITUTION:Tips of an upper and a lower films 1a, 1b are sealed by packaging, and when an object 3 to be packaged proceeds by being pushed by a pushing device 4, both films 1a, 1b are drawn out from material rolls 2a, 2b by being pushed by the object 3 to be packaged. A front seal 7a is wound under the object 3 which enters between both films 1a, 1b. A ring 8 makes continuous scores for cutting approximately at the center of the lower film 1b. A pressing device 10 lowers to press the object 3 interposed between both films 1a, 1b from upward to maintain tension of the lower film 1b especially. A seal cutting device 11 lowers to seal and cut both films 1a, 1b in the back of the object 3. The object 3 is fed into a heating tunnel 12 and both films 1a, 1b are heat- shrunk to be tightly attached to the object 3.