OPTICALLY COUPLED STRUCTURE OF PHOTOSEMICONDUCTOR CHIP AND OPTICAL FIBER

PURPOSE:To eliminate the thermal stresses to be applied on an optical fiber by inserting the part of the optical fiber near its end freely slidably into a capillary pipe having the inside diameter slightly larger than the outside diameter of the optical fiber. CONSTITUTION:The part of the optical fiber 3 near its end is inserted freely slidably into the capillary pipe 4 having the inside diameter slightly larger than the outside diameter of the optical fiber 3. The capillary pipe 4 is fixed to a housing 1. The optical fiber 3 is fixed in the housing 1 by sealing an optical fiber introducing hole 5 of the housing 1. The optical fiber 3, therefore, slides relative to the capillary pipe 4 according to the difference between the coefft. of thermal expansion of the housing 1 and the coefft. of thermal expansion of the optical fiber 3 even if the housing 1 and the optical fiber 3 are expanded or shrunk by the temp. change given applied thereto. The possibility that the optical fiber is thermally stressed is eliminated in this way.