ELECTRONIC COMPONENT

PURPOSE:To improve an electronic component in heat dissipation, to improve an LED in luminance, and to make a board small in size by a method wherein a conductor circuit is formed on the upside of a glass epoxy board covered with alumina ceramic and inside the through-hole of the glass epoxy board, and the LED element and a drive IC element are mounted on the conductor circuit and connected with each other through a wire. CONSTITUTION:The surface of a glass epoxy board 1 is coated with an alumina ceramic coating 2 through the flame spraying of alumina ceramic onto it to form an alumina coated glass epoxy board 3. Through-holes 4 are provided to optional positions on the alumina coated glass epoxy board 3, and conductor circuits 5 are formed on the upside of the alumina ceramic coating 2 and inside the through-holes 4. Moreover, an LED element 7 and a drive IC element 8 are bonded to the upper part of the conductor circuits 5 by the use of silver paste 9, the LED element 7 and the drive IC element 8 are connected with each other through a gold wire 10. By this setup, an electronic component of this design can be improved in heat dissipation, a board can be made small in size, and an LED can be improved in luminance.