ELECTRONIC COMPONENT MOUNTING DEVICE

PURPOSE:To enable various kinds of surface mounting electronic components to be mounted at a high speed by a method wherein two or more pivotable auxiliary holders are fitted to a main holder which makes an index rotation, and two or more kinds of suction heads are held by the auxiliary holders. CONSTITUTION:Auxiliary holders 4 successively circuit stations I-IV with the index rotation of a main holder 1. At the component suction station I, a suction head 9 is pushed down through an up-down means 24 to suck a component of a sucking object such as a large component 29. After a sucking operation is finished, the up-down means 24 is drawn out from the holder 4, the head 9 sucked the component is restored to its ascent position. At this point, an up-down means 25 pushes a suction head 10 which transfers a component from the station I to make a sucked component (small component 28) bear against a circuit board 22. The component 28 is made to adhere to the board 22 through an adhesive agent previously applied onto the specified position on the board 22. After the suction and the mounting of a component are finished, an index shaft is made to pivot by an angle of 90 degrees and the holders 4 are made to move to the next stations respectively.