MULTILAYER PRINTED WIRING BOARD

PURPOSE:To enable a multilayer printed wiring board to be easily divided into pieces of an actual service size along a V groove by a method wherein the the V-shaped groove is provided to the wiring board in such a manner that only a glass nonwoven cloth layer is left unremoved where the V-shaped gro...

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Bibliographische Detailangaben
Hauptverfasser:	MITSUHASHI KAZUNORI, NASU YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING GRANULES OR PREFORMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PRINTED CIRCUITS RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To enable a multilayer printed wiring board to be easily divided into pieces of an actual service size along a V groove by a method wherein the the V-shaped groove is provided to the wiring board in such a manner that only a glass nonwoven cloth layer is left unremoved where the V-shaped groove is provided. CONSTITUTION:Conductors are provided to an inner and an outer side of a multilayer printed wiring board through the intermediary of an insulating layer. The insulating layer is formed into a multilayer printed wiring board in such a manner that glass nonwoven cloth layer 2 is sandwiched between the glass woven cloth layers 3 and a V-shaped groove 4 is provided to a specified position on both the sides of the multilayer printed wiring board respectively so as to reach to the center layer 3, where the cloth layers 2 and 3 are impregnated with thermosetting resin. And, the thickness of the layer 2 is one fourth or more of that of the multilayer printed wiring board.