METAL WIRING METHOD FOR SEMICONDUCTOR ELEMENT

PURPOSE: To eliminate the increase of the wiring resistance of a metallic wiring film connecting each element, etc., and to improve the performance characteristic of a semiconductor element, and then, to simplify a process by forming an ohm contact containing the same type of impurity at the contact...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIN ICHIGEN, KIN GENTETSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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