MANUFACTURE OF FLEXIBLE WIRING BOARD AND APPARATUS THEREFOR

PURPOSE:To improve the productivity of a punching process by performing punching work in such a manner that although each inner hole is punched out thoroughly up to each protective film, only a flexible film and adhesives in the shape are cut down and the protective film is left as it is kept in a c...

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Bibliographische Detailangaben
1. Verfasser: NEMOTO KATSUHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To improve the productivity of a punching process by performing punching work in such a manner that although each inner hole is punched out thoroughly up to each protective film, only a flexible film and adhesives in the shape are cut down and the protective film is left as it is kept in a continuous state. CONSTITUTION:An insulating coating material has a three layer structure which is composed of a flexible film 1, adhesive 2, and a protective film 3 of the adhesives. Only the flexible film 1 and the adhesive 2 are cut at the size of each region 4 which is almost required by coating of a flexible wiring board. Then the flexible film 1, the adhesive 2, and the protective film 3 are stamped at the size of a region 5 which is required to connect a conductor on the flexible wiring board to other circuits and electronic component parts and then a plurality of the flexible films 1 together with the adhesive 2 are left on a continuous protective film 3. Punching work is thus performed continuously and productivity is improved.