DOUBLE POLISHING METHOD FOR TITANIUM PLATE

PURPOSE:To produce a stable and specified polishing effect and to improve a yield by a method wherein, when both surfaces of a titanium plate are simultaneously polished in a sate to hold the titanium plate by means of carriers, a condition to satisfy a specified relation between the thickness of th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUENAGA HIROYOSHI, MINAGAWA KUNINORI, FUKAI HIDEAKI, TAKEUCHI HIROYOSHI, ITO TAKESHI, TAKAGI MASAKUNI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To produce a stable and specified polishing effect and to improve a yield by a method wherein, when both surfaces of a titanium plate are simultaneously polished in a sate to hold the titanium plate by means of carriers, a condition to satisfy a specified relation between the thickness of the titanium plate and that of the carrier is kept. CONSTITUTION:A titanium plate 6 being a plate to be polished is held in a state to be loosely engaged with a carrier 5, and is moved linkage with movement of the carrier 5. Meanwhile, a polishing pressure from platens 1 and 2 is exerted on grinding particles 7 present on the surface of the titanium plate 6. The thickness of the titanium plate 6 is tmm and the thickness of the carrier 5 is Tmm and by setting a relation between the thicknesses to 0.025e