HEAT CONDUCTING COMPOUND

PURPOSE: To enhance the stability of a phase by dispersing specified thermally conductive particles into a chemically matching liquid carrier and admixing with a specified additive for enhancing dispersion and stability thereby providing stabilized thermal conductivity and viscosity for transmitting heat from an electronic device. CONSTITUTION: Thermally conductive filter particles having higher surface energy than a dielectric liquid carrier (chemically saturated oil hydrocarbon) are dispersed uniformly into a carrier and admixed with a coupling agent having a functional group reacting on the surface of the particle and a functional group for wetting the particle preferentially through self condensation. Consequently, viscosity and surface energy are reduced while conforming to the surface of an electronic device, thermal conductivity is maximized while having a high filling density and phase separation can be prevented by sustaining uniform dispersion of the particles.