SEMICONDUCTOR DEVICE PACKAGE

PURPOSE:To improve heat radiation characteristics by a method wherein a fin-shaped cooling structure made of metal copper or silicon carbide ceramics is bonded with silver solder to a silicon carbide ceramic board supporting a semiconductor chip at their metallized surfaces. CONSTITUTION:A fin-shaped cooling structure 10 made of metal copper or silicon carbide ceramics is bonded with silver solder 6 to a silicon carbide ceramic board 2 supporting a semiconductor chip 5 at their metallized surfaces 7a and 7b. With this construction, heat generated by the chip 5 is emitted out through the board 2, the silver solder junction 9 and the structure 10. As the silver solder has a higher thermal conductivity than metal copper and silicon carbide ceramics, the heat radiation characteristics are not degraded by the silver solder junction.