POLYAMIDE RESIN COMPOSITION

PURPOSE:To obtain the subject composition giving a molded article having excellent mechanical strength and heat-resistance, free from warpage and suitable for electrical parts, mechanical parts, etc., by compounding a polyamide resin with sepiolite at a specific ratio. CONSTITUTION:The objective com...

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Bibliographische Detailangaben
Hauptverfasser:	ONISHI KATSUMI, ODA HIDEHIRO, IIZUKA HIROKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the subject composition giving a molded article having excellent mechanical strength and heat-resistance, free from warpage and suitable for electrical parts, mechanical parts, etc., by compounding a polyamide resin with sepiolite at a specific ratio. CONSTITUTION:The objective composition is produced by compounding (A) 95-50 wt.% of a polyamide resin (e.g. nylon 6 or nylon 66) with (B) 5-50wt.% of sepiolite which is a fibrous mineral composed mainly of a compound of formula Mg8Si12O30(OH)4.8H2O and having fiber diameter of 0.1-0.2mum and fiber length of 3-30mum.