HEAT-AND FIRE-RESISTANT COMPOSITION HAVING WATER DISPERSIBILITY

PURPOSE:To make it possible to form a water-dispersible, heat- and fire-resistant composition excellent in adhesiveness, flexibility, gloss and water repellency by mixing a post-emulsifiable aqueous dispersion of a specified silicone resin with a synthetic resin emulsion and a specified glass frit....

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Bibliographische Detailangaben
Hauptverfasser:	HORIE YASUNOBU, AIZAWA YUKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PURPOSE:To make it possible to form a water-dispersible, heat- and fire-resistant composition excellent in adhesiveness, flexibility, gloss and water repellency by mixing a post-emulsifiable aqueous dispersion of a specified silicone resin with a synthetic resin emulsion and a specified glass frit. CONSTITUTION:This composition comprises at least one post-emulsifiable aqueous dispersion (a) selected from a silicone resin composition of formula I (wherein R, R' and R'' are each a 1-12C alkyl, a phenyl or a phenyl substituted by a 1-12C alkyl; and x and y are molar fractions and have values to give a sum of 1) and a modified silicone resin prepared by condensing the above silicon resin composition with an alkyd, polyester, epoxy or acrylic resin through dehydration; an organic polymer emulsion (b) of a pH of 7-10 and a glass frit of an m.p. of 300-500 deg.C or an inorganic powder (c) containing at least 10wt.% same. The mixing ratio is such that 30-500 pts.wt. component (b) and 10-2000 pts.wt. component (c) are present per 100 pts.wt. component (a).