HYBRID INTEGRATED CIRCUIT DEVICE

PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a mult...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKAHARA MASAHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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