HYBRID INTEGRATED CIRCUIT DEVICE

HYBRID INTEGRATED CIRCUIT DEVICE

PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a mult...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: TAKAHARA MASAHARU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a multilayer substrate 2 at approximately 45 deg. to one side of the substrate 2. Concentration of a wiring 3 between a terminal of the device 1 and a pad 4 of the substrate can be thereby relieved and an unconnected wiring can be eliminated. Packaging density can be improved in this way.