HYBRID INTEGRATED CIRCUIT DEVICE
PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a mult...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TAKAHARA MASAHARU |
| description | PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a multilayer substrate 2 at approximately 45 deg. to one side of the substrate 2. Concentration of a wiring 3 between a terminal of the device 1 and a pad 4 of the substrate can be thereby relieved and an unconnected wiring can be eliminated. Packaging density can be improved in this way. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0216791A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0216791A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0216791A3</originalsourceid><addsrcrecordid>eNrjZFDwiHQK8nRR8PQLcXUPcgxxdVFw9gxyDvUMUXBxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GRoZm5paGjsZEKAEAtXAhpw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HYBRID INTEGRATED CIRCUIT DEVICE</title><source>esp@cenet</source><creator>TAKAHARA MASAHARU</creator><creatorcontrib>TAKAHARA MASAHARU</creatorcontrib><description>PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a multilayer substrate 2 at approximately 45 deg. to one side of the substrate 2. Concentration of a wiring 3 between a terminal of the device 1 and a pad 4 of the substrate can be thereby relieved and an unconnected wiring can be eliminated. Packaging density can be improved in this way.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900119&DB=EPODOC&CC=JP&NR=H0216791A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19900119&DB=EPODOC&CC=JP&NR=H0216791A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKAHARA MASAHARU</creatorcontrib><title>HYBRID INTEGRATED CIRCUIT DEVICE</title><description>PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a multilayer substrate 2 at approximately 45 deg. to one side of the substrate 2. Concentration of a wiring 3 between a terminal of the device 1 and a pad 4 of the substrate can be thereby relieved and an unconnected wiring can be eliminated. Packaging density can be improved in this way.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDwiHQK8nRR8PQLcXUPcgxxdVFw9gxyDvUMUXBxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GRoZm5paGjsZEKAEAtXAhpw</recordid><startdate>19900119</startdate><enddate>19900119</enddate><creator>TAKAHARA MASAHARU</creator><scope>EVB</scope></search><sort><creationdate>19900119</creationdate><title>HYBRID INTEGRATED CIRCUIT DEVICE</title><author>TAKAHARA MASAHARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0216791A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1990</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKAHARA MASAHARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKAHARA MASAHARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HYBRID INTEGRATED CIRCUIT DEVICE</title><date>1990-01-19</date><risdate>1990</risdate><abstract>PURPOSE:To eliminate an unconnected wiring and to improve a packaging density by packaging a semiconductor integrated circuit device at approximately 45 deg. to two parallel sides of a multilayer substrate. CONSTITUTION:A plurality of semiconductor integrated circuit devices 1 are packaged on a multilayer substrate 2 at approximately 45 deg. to one side of the substrate 2. Concentration of a wiring 3 between a terminal of the device 1 and a pad 4 of the substrate can be thereby relieved and an unconnected wiring can be eliminated. Packaging density can be improved in this way.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH0216791A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | HYBRID INTEGRATED CIRCUIT DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T11%3A07%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKAHARA%20MASAHARU&rft.date=1990-01-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0216791A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |