MOLDED BOARD TYPE MODULAR JACK

PURPOSE:To reduce number of assembling manhour and production cost by providing a conductor pattern on one plane or three-dimensionally and forming a part thereof integrally with an insulator to form a molded board part and thereafter bending a part of the conductor pattern and inserting it into a h...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SASAKI MASAO, ISHIZUKA HIRONORI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To reduce number of assembling manhour and production cost by providing a conductor pattern on one plane or three-dimensionally and forming a part thereof integrally with an insulator to form a molded board part and thereafter bending a part of the conductor pattern and inserting it into a housing to carry out assembling. CONSTITUTION:A conductor pattern 1, which is a stamped spring material, is provided on one plane or three-dimensionally, and an insulator 2 is integrally molded on the conductor pattern to form a molded board part A. A leg 1A of this board part A is used for connection with the board, and a spring contact 1b, and a hole C in a part of the conductor pattern 1 are provided, and an exposed part 2b is used as a mounting pad for a functional part and is also utilized for lead wire mounting. The contact, etc., of this board part A are bent beforehand and inserted into a housing 3 to assemble a modular jack, and a terminating function noise killer 4 is soldered to a hole 1c at the half way part of the conductor pattern 1.