FILM FORMING DEVICE BY SPUTTERING
PURPOSE:To change the incident angle of an ion to the surface of a target and to form a uniform thin film by providing a power source device for impressing a modulated DC voltage on an electrode for accelerating the ion in the plasma produced by a couple of plate electrodes and a magnetic-field coil...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To change the incident angle of an ion to the surface of a target and to form a uniform thin film by providing a power source device for impressing a modulated DC voltage on an electrode for accelerating the ion in the plasma produced by a couple of plate electrodes and a magnetic-field coil. CONSTITUTION:A voltage is impressed on a couple of discharged electrodes 14 by a discharge AC power source 11, Ar is introduced from an Ar gas inlet 19, and the AC discharge plasma of Ar is produced. The plasma is confined between the electrodes 14 by the line of magnetic force of the magnetic-field coil 12, and the ion in the plasma is injected into a target material 15 by the voltage of several kilovolts impressed on a target incident ion accelerating electrode 16 integrated with the target material 15. At this time, a sinusoidal voltage is used in the AC power source 11, modulation is applied on a variable DC power source 17 through a function generator 18, hence the sputtered particles are not deflected, and a uniform thin film is formed on a substrate 13. |
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