MANUFACTURE OF MODULE FOR IC CARD

PURPOSE:To see that resin burrs do not occur at a contact face of an IC card so as to improve mess productivity by providing a part for mounting an IC chip made of thermoplastic resin on the rear of a lead frame, and connecting the IC chip with the lead frame electrically, and molding them by resin. CONSTITUTION:The part up to projections 9c which are formed at a connection part 9b on the rear side of a lead frame 9 is covered with thermoplastic resin 10. In the one with which thermoplastic resin 10 is used, since the viscosity is high, the resin 10 never permeates into the surface side from between contacts 9a, so thin burrs never occurs. This way, by formation at the first stage, an insulating layer 10a is provided between contacts 9a, and an IC chip 11 is mounted inside the frame part 10b on the rear side of the lead frame 9 by insulating adhesive 12, and a wiring pad of the IC chip 11 and a wire bonding 9d formed at the lead frame 9 are connected by wiring 13. Thereafter, by thermosetting resin (or thermoplastic resin) 14, the IC chip 11 is covered at the rear side of the lead frame 9.