EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTORS

PURPOSE:To obtain the title composition for sealing transistors or integrated circuits having excellent fluidity and elasticity reduction effect on the cured products by adding an epoxy resin. a curing agent, a curing accelerator and a filling agent to a specific silicone modified phenolic resin. CO...

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Bibliographische Detailangaben
Hauptverfasser:	ICHIMURA SHIGEKI, KINASHI KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS RESISTORS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the title composition for sealing transistors or integrated circuits having excellent fluidity and elasticity reduction effect on the cured products by adding an epoxy resin. a curing agent, a curing accelerator and a filling agent to a specific silicone modified phenolic resin. CONSTITUTION:(A) A silicone-modified phenolic resin which is prepared by dehydrative condensation reaction between a carboxyl group-containing organosiloxane of the formula (n is 1 to 300; R1 is a divalent hydrocarbon; R2, R3 are methyl, phenyl) and a novolak type phenolic resin, preferably at a ratio of 1 carboxyl group of the former component to more than 10 phenolic hydroxyl groups of the latter is combined with (B) an epoxy resin, preferably 180 to 200 epoxy equivalent, (C) a curing agent, preferably novolak phenoxy resin, (D) a curing accelerator, for example, tributylamine and (E) a filler such as silica to give the objective composition.