PACKAGING STRUCTURE FOR SEMICONDUCTOR DEVICE

PURPOSE:To make possible a highly reliable high-density packaging using s thin film chip by a method wherein the electrical writing and ultraviolet light erasable ROM chip is directly mounted on a wiring board and is sealed with an ultraviolet transmitting resin. CONSTITUTION:An electrical writing and ultraviolet light erasable EPROM chip 2 is placed on a wiring board 1 through a chip mounting material 3 and after being connected electrically to the substrate 1 by wiring materials 4 for connection use, the chip 2 is sealed with an ultraviolet transmitting resin 5. As this resin 5 is an ultraviolet transmitting resin, an erase of data is possible by ultraviolet light irradiation. Moreover, as the periphery of the ROM chip is sealed with the resin 5, bending and warpage do never have an effect on the wiring materials 4 between the chip and the substrate even if the bending and the warpage, which are caused by an external force, are generated in the substrate 1 formed into a thin thickness. Thereby, a high-reliability and high- density packaging becomes possible and a useful packaging structure is obtained.