CHEMICAL VAPOR DEPOSITION METHOD ONTO SEMICONDUCTOR SUBSTRATE

PURPOSE: To generate a plasma more by irradiating the gas in a reaction chamber with a low-frequency, low-voltage RF wave and then irradiating it with a lower-voltage, higher RF wave. CONSTITUTION: A substrate is placed on the surface 1 in the reaction chamber 2, reaction gas is admitted through a p...

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Bibliographische Detailangaben
Hauptverfasser: REOPORUDO DEI YAU, GAREN EICHI KAWAMOTO
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE: To generate a plasma more by irradiating the gas in a reaction chamber with a low-frequency, low-voltage RF wave and then irradiating it with a lower-voltage, higher RF wave. CONSTITUTION: A substrate is placed on the surface 1 in the reaction chamber 2, reaction gas is admitted through a pipe 4, and an RF wave is admitted to an electrode 3 from an RF generating device 5 through a feeder 19 to produce an RF electromagnetic field in the chamber 2. The timing of a high-frequency signal and a low-frequency signal applied to the feeder 19 is obtained by placing radio frequency generators 10 and 11 in operation through a control interface 12. Consequently, pulses of about 55kHz in frequency and 1000W in electric power are applied to the electrode 3 for about 6ms to ionize the gas in the chamber 2, thereby generating a plasma. When the gas begins to be ionized, pulses of about 13MHz are generated with about 250W and applied to the electrode 3 for about 55mn to further carry out ionization more than that.