MANUFACTURE OF CERAMIC CIRCUIT BOARD

PURPOSE:To strengthen adhesive strength to a metal film, to reduce irregularity in the strength and to prevent the swell of the film by dipping ceramics in SnF2 solution to simultaneously roughen and sensitize it, washing it and then activating it. CONSTITUTION:An alumina ceramic board roughened on its surface is cleaned with degreasing solution, neutralized, washed with water, then dipped in SnF2 solution to be simultaneously roughened and sensitized, further washed with water, and dipped in PdCl2 to be activated. It is then electrolessly copper-plated to form a copper film having 0.8mum of thickness. After plating, a ceramic circuit board with a conductor circuit is obtained by an etching method using general photoresist (forming, exposing, developing, etching of a resist film and peeling of the film). The adhesive strength of the board obtained in this manner exhibits 1.8-30.0kg/mm , 2.5kg/mm of mean value, and no external copper film swell is observed.