MANUFACTURE OF THICK FILM WIRING BOARD

MANUFACTURE OF THICK FILM WIRING BOARD

PURPOSE:To improve accuracy by forming a thick film electrode continuously in one piece and by dividing it into independent thick film electrodes by a laser method, etching method or machine processing. CONSTITUTION:A thick film electrode 5 is formed din one piece continuously and it is divided into...

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Hauptverfasser: TAKEOKA TETSUO, YAMANAKA HISAYOSHI, ISOGAI TOKIO, KIKUCHI MITSUO
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAKEOKA TETSUO
YAMANAKA HISAYOSHI
ISOGAI TOKIO
KIKUCHI MITSUO
description PURPOSE:To improve accuracy by forming a thick film electrode continuously in one piece and by dividing it into independent thick film electrodes by a laser method, etching method or machine processing. CONSTITUTION:A thick film electrode 5 is formed din one piece continuously and it is divided into individual independent thick film electrode 6 by the laser method, the etching method, or machine processing. Machine processing by a diamond saw is desirable as machine processing for dividing the thick film electrode 5 which is formed continuously in one piece. Thus, the pitch width of the electrode 6 can be reduced to 400mum or less the thick film electrode width 5 can be reduced to 150mum or less and each accuracy can be reduced to + or -20mum or less.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MANUFACTURE OF THICK FILM WIRING BOARD
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