MANUFACTURE OF THICK FILM WIRING BOARD

PURPOSE:To improve accuracy by forming a thick film electrode continuously in one piece and by dividing it into independent thick film electrodes by a laser method, etching method or machine processing. CONSTITUTION:A thick film electrode 5 is formed din one piece continuously and it is divided into individual independent thick film electrode 6 by the laser method, the etching method, or machine processing. Machine processing by a diamond saw is desirable as machine processing for dividing the thick film electrode 5 which is formed continuously in one piece. Thus, the pitch width of the electrode 6 can be reduced to 400mum or less the thick film electrode width 5 can be reduced to 150mum or less and each accuracy can be reduced to + or -20mum or less.