FORMING METHOD OF ELECTRODE ON MICROWAVE DIELECTRIC CERAMIC

PURPOSE:To improve reliability by changing a copper film formed through electroless plating into an electrode through specific treatment. CONSTITUTION:A copper film shaped through electroless plating is thermally treated at 500-700 deg.C in an inert gas atmosphere having oxygen partial pressure of 1...

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Bibliographische Detailangaben
Hauptverfasser: YAHAGI MASAHIRO, KIKUCHI TATSUYA, SHIKAUCHI SHINICHI, TANIGUCHI MASAAKI, MORI KANEO
Format: Patent
Sprache:eng
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