THERMAL HEAD

PURPOSE:To ensure that a required thickness is obtained during assembly and at the same time, a higher heat conductivity than a heat-resistant synthetic resin layer is obtained. CONSTITUTION:Heat-resistant synthetic resin film 4a is, for instance, made of polyethylene terephthalate, polyimide, polye...

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Bibliographische Detailangaben
Hauptverfasser:	YAMANE SUMITO, YAMAZAKI SATORU, MURAKAMI SADATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PURPOSE:To ensure that a required thickness is obtained during assembly and at the same time, a higher heat conductivity than a heat-resistant synthetic resin layer is obtained. CONSTITUTION:Heat-resistant synthetic resin film 4a is, for instance, made of polyethylene terephthalate, polyimide, polyethersulfone or polyphenylenesulfide. Its recommendable thickness is 3 to 100mum. If the electrically insulative heat releasing sheet is used which consists of laminated mica foil 7 and epoxy resin as synthetic resin of thermally melting solidification type with polyethyleneterephthalate film which is the same as heat-resistant synthetic resin, the thermal conductivity is 10X10cd/cm/sec/ deg.C. Thus the thermal conductivity is increased by a factor of 2 to 3.